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* buildc.t, buildrt.t, started/nt.t, sample.t, tversions.texi: Don't use VARIABLEs containing '-' in @set and @value (violates texi-syntax).
136 lines
3.9 KiB
Perl
136 lines
3.9 KiB
Perl
@c
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@c COPYRIGHT (c) 1988-2002.
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@c On-Line Applications Research Corporation (OAR).
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@c All rights reserved.
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@c
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@c $Id$
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@c
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@chapter Building the Sample Application
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@section Unarchive the Sample Application
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Use the following command to unarchive the sample application:
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@example
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cd tools
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tar xzf ../archive/hello_world_c.tgz
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@end example
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@section Set the Environment Variable RTEMS_MAKEFILE_PATH
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RTEMS_MAKEFILE_PATH must point to the appropriate directory containing
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RTEMS build for our target and board support package combination.
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@example
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export RTEMS_MAKEFILE_PATH=<INSTALLATION_POINT>/<BOARD_SUPPORT_PACKAGE>
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@end example
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Where <INSTALLATION_POINT> and <BOARD_SUPPORT_PACKAGE> are those used when
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configuring and installing RTEMS.
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NOTE: In release 4.0, BSPs were installed at
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@code{<INSTALLATION_POINT>/rtems/<BOARD_SUPPORT_PACKAGE>}. This
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was changed to be more in compliance with GNU standards.
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@section Build the Sample Application
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Use the following command to start the build of the sample hello
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world application:
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@example
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cd hello_world_c
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make
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@end example
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NOTE: GNU make is the preferred @code{make} utility. Other @code{make}
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implementations may work but all testing is done with GNU make.
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If no errors are detected during the sample application build, it is
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reasonable to assume that the build of the GNU C/C++ Cross Compiler Tools
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for RTEMS and RTEMS itself for the selected host and target
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combination was done properly.
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@section Application Executable
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If the sample application has successfully been built, then the application
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executable is placed in the following directory:
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@example
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hello_world_c/o-optimize/<filename>.exe
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@end example
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How this executable is downloaded to the target board is very dependent
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on the BOARD_SUPPORT_PACKAGE selected. The following is a list of
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commonly used BSPs classified by their RTEMS CPU family and pointers
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to instructions on how to use them. [NOTE: All file names should be
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prepended with @value{RTEMSUNTAR}/c/src/lib/libbsp.]
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@need 1000
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@table @b
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@item i386/pc386
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See @code{i386/pc386/HOWTO}
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@item i386/pc486
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The i386/pc386 BSP specially compiled for an i486-class CPU.
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@item i386/pc586
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The i386/pc386 BSP specially compiled for a Pentium-class CPU.
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@item i386/pc686
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The i386/pc386 BSP specially compiled for a Pentium II.
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@item i386/pck6
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The i386/pc386 BSP specially compiled for an AMD K6.
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@item m68k/gen68360
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This BSP is for a MC68360 CPU. See @code{m68k/gen68360/README} for details.
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@item m68k/mvme162
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See @code{m68k/mvme162/README}.
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@item m68k/mvme167
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See @code{m68k/mvme167/README}.
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@item powerpc/mcp750
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See @code{powerpc/motorola_shared/README}.
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@item powerpc/mvme230x
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See @code{powerpc/motorola_shared/README.MVME2300}.
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@item powerpc/psim
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This is a BSP for the PowerPC simulator included with @code{powerpc-rtems-gdb}.
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The simulator is complicated to initialize by hand. The user is referred
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to the script @code{powerpc/psim/tools/psim}.
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@item sparc/erc32
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The ERC32 is a radiation hardened SPARC V7. This BSP can be used with
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either real ERC32 hardware or with the simulator included with
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@code{sparc-rtems-gdb}. An application can be run on the simulator
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by executing the following commands upon entering @code{sparc-rtems-gdb}:
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@example
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target sim
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load
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run
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@end example
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@end table
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RTEMS has many more BSPs and new BSPs for commercial boards and CPUs
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with on-CPU peripherals are generally welcomed.
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@section More Information on RTEMS Application Makefiles
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The hello world sample application is a simple example of an
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RTEMS application that uses the RTEMS Application Makefile
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system. This Makefile system simplifies building
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RTEMS applications by providing Makefile templates and
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capturing the configuration information used to build
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RTEMS specific to your BSP. Building an RTEMS application
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for different BSPs is as simple as switching the
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setting of @code{RTEMS_MAKEFILE_PATH}. This Makefile
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system is described in the file
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@code{make/README}.
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